Epoxy Sealing (EP) - A low-density
(lightweight), syntactic foam epoxy resin for electronic
encapsulation and perimeter sealing. When cured the material
is completely uni-cellular and therefore the moisture absorption
is negligible. The material exhibits a low dielectric constant,
low coefficient of thermal expansion and low cure shrinkage.
It contains microballoons to reduce thermal conductance.
Usable temperature range is -40 to +130°C. |