Interface Pads
Melcor provides three series of interface pads, with four different conductive materials. All of the interface pads can be used in situations of mismatched CTEs.
 
Interface Pad Series Descriptions
Adhesive Interface pads (ADI)
Simple to apply, requiring low mounting pressures. Melcor offers Aluminum Oxide pads, which are similar in performance to thermal grease, or high performance Aluminum Nitride.
Graphite Foil Interface pads (GRF)
Excellent performance and easy to apply. Can be used at very high operating temperatures.
ThermoSet Interface pads (TSI)
These pads generally need to be heated prior to use, but they have lower thermal resistance and can be used with low mounting pressures. Melcor offers either Paraffin/Aluminum or Aluminum Nitride.

 

Adhesive Interface Pad (ADI) Specifications
Model Material Thermal Conductivity (W/m-K) Length (mm) Width (mm) Thickness (mm) Quantity
ADI-ALO-119-135 Al2O3 1.7 30 34 0.10 10 pcs.
ADI-ALO-600-600 Al2O3 1.7 152 152 0.10 1 pc.

 

Graphite Foil Interface Pad (GRF) Specifications
Model Material Thermal Conductivity (W/m-K) Length (mm) Width (mm) Thickness (mm) Quantity
GRF-119-135 97% Graphite 5.0 30 34 0.13 10 pcs.
GRF-159-174 97% Graphite 5.0 40 44 0.13 10 pcs.

 

ThermoSet Interface Pad (TSI) Specifications
Model Material Thermal Conductivity (W/m-K) Length (mm) Width (mm) Thickness (mm) Quantity
TSI-PAL-159-174 Paraffin/Al 6.2 40 44 0.08 10 pcs.

 

 

Recommended Compression
Type
Reflow Temperature
Maximum Operating Temperature
(kPa)
(psi)
ADI
N/A
150°C
100 - 2070
15 - 300
GRF
N/A
450°C
1000 - 2070
150 - 300
TSI-PAL
51°C
200°C1
690 - 20702
100 - 3002
1 200°C maximum temperature given for operation in a horizontal orientation.
2 Lower mounting pressures are possible. Please contact MELCOR for information on performance effects.