| Heat Pumped at Cold Surface: |
QC = 2N [α I TC
- ((I2 Ρ) / (2 G)) - κDT
G] |
| Voltage: |
V = 2N [((I p) / G) + (a DT)] |
| Maximum Current: |
Imax = (κG / α) [(1 +
(2 Z TH))1/2 - 1] |
| Optimum Current: |
Iopt = [κDT
G (1 + (1 + Z Tave)1/2)] / (α Tave) |
Optimum COP
(calculated at Iopt): |
COPopt = (Tave / DT)
[((1 + Z Tave)1/2 - 1) / ((1 + Z Tave)1/2
+ 1)] - 1/2 |
| Maximum DT with
Q = 0 |
DTmax
= TH - [(1 + 2 Z TH)1/2 -
1) / Z] |
|
Miscellaneous
Expressions
Notation |
Definition |
| TH
|
Hot Side Temperature
(Kelvin) |
| TC
|
Cold Side Temperature
(Kelvin) |
| DT
|
TH - TC
(Kelvin) |
| Tave |
1/2 (TH
+ TC) (Kelvin) |
| G |
Area / Length of T.E.
Element (cm) |
| N
|
Number of Thermocouples |
| I |
Current (amps) |
| COP
|
Coefficient of Performance
(QC / IV) |
| α
|
Seebeck Coefficient
(volts / Kelvin) |
| Ρ
|
Resistivity (Ω cm)
|
| κ
|
Thermal Conductivity
(watt / (cm Kelvin)) |
| Z
|
Figure of Merit (α2
/ (Ρ κ)) (Kelvin-1) |
| S
|
Device Seebeck Voltage
(2αN) (volts / Kelvin) |
| R
|
Device Electrical
Resistance (2ΡN/G) (ohms) |
| K |
Device Thermal Conductance
(2κNG) (Watt / Kelvin) |
|
