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Direct Liquid Systems (DL)
Direct-Liquid assemblies are used to cool or heat either objects attached directly
to the cold plate, or enclosures by attaching a thermal conductive container to the
cold plate. Heat is dissipated to a liquid on the warm side.
The liquid circuit is normally of a recirculating type with a pump and a liquid-to-air
heat exchanger removing the heat into the ambient air.
By using an efficient heat exchanger and one or more DL-assemblies a very powerful
yet compact system is created.
Our standard assemblies are optimized for high cooling capacity and efficiency
rather than maximum delta T. Typical applications include temperature cycling of
electronic components, laser cooling and analytical instruments.
Product specifications
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| Part # |
Cooling Power Pc max (W) |
Pc Curve type |
Current (A) |
Power Input (W) |
Ambient max (oC) |
Weight (kg) |
Lw (mm) |
Lc (mm) |
Ww (mm) |
Wc (mm) |
Hw (mm) |
Hc (mm) |
| DL-060-12-00 |
59 |
C |
4.2 |
50 |
63 |
0.4 |
100 |
60 |
60 |
60 |
15 |
24 |
| DL-120-24-00 |
122 |
C |
4.2 |
101 |
62 |
0.7 |
140 |
120 |
60 |
60 |
15 |
24 |
| DL-210-24-00 |
207 |
C |
8.1 |
194 |
62 |
1.3 |
240 |
220 |
60 |
60 |
15 |
24 |
*Specifications apply to warm side Liquid temperature 32°C and nominal Voltage. Tolerances ±10%
Ex =Example: At 32°C inlet liquid temperature
and cold plate temperature of 2°C (delta T = 30°C) the DL-120-24-00 (curve C)
cools by 32% of its maximum effect, which gives Pc = 122 x 0.32 = 39 W (±10%)
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