The information requested below is vital to the design/selection of a thermoelectric device to achieve your desired performance.

Please attempt to define as many of your application's existing conditions and limiting factors as possible. (Please indicate units on all parameters.)

I. Ambient Environment

• Temperature = ____________________
• Air
• Vacuum
• Other

II. Cold Spot

Temperature: ______________

Size: ______________

Insulated? ___________Type:_____________Thickness: _____________

Desired Interface:

• Plate
• Fins
• Fluid Flow (parameters) ________________
• Other _______________

III. Heat Sink

• Finned - Free Convection
• Finned - Forced Convection
• Liquid Cooled
• Maximum Heat Sink Temp. _________________
• -or-Heat Sink Rating (°C/W) ___________________

IV. Heat Load at Cold Spot = ____________________

(if applicable, above should include:)

Active:

I²R __________________

Passive:

Radiation= _________________

Convection= ________________

Insulation Losses= _________________

Conduction Losses= ________________(e.g. leads)

Transient Load= _________________(Mass - time)

V. Restrictions on Power Available

(indicate most important)

• Current: _________________
• Voltage: __________________
• Power: __________________
• No Restrictions

VI. Restrictions on Size: ___________________

VII. To ensure the most effective response, please provide a rough, dimensioned sketch of the application, indicating the anticipated physical configuration and thermoelectric module placement.

Please print this form and fill in the blanks