Bonded Fin Heat Sinks    
 
Features
  • High fin density (up to 8 fins/inch)
  • Optional fan mount bracket
  • Machined base
  • Sensor hole for temperature monitoring
  • Tapped or clearance holes
  • Metric (M3) tapped holes

The Melcor Thermal Solutions bonded fin heat sinks are designed specifically for our CP, PT and HT Series thermoelectric devices. These high performance heat sinks are ideal for fan forced convection and are available with fan mount brackets. Each bonded fin heat sink is part of a series of matching components designed to work together as a complete thermoelectric system.
 
Mechanical Characteristics
 

 

Model Dimensions and Performance

Model F fins/in Dimensions Assembly Holes Performance
W in (mm) L in (mm) H in (mm) A Type B Type Spacing °C/Watts
HX8-101 8 2.0 (51) 2.0 (51) 1.25 (32) Tapped Tapped 1.5” O.C. 0.61 @ 6.7CFM
HX6-201 6 3.0 (76) 3.0 (76) 1.25 (32) Clearance Tapped 2.0” O.C. 0.39 @ 18CFM
HX5-301 5.5 6.0 (152) 6.0 (152) 2.9 (74) Clearance Tapped 3.0” O.C. 0.07 @ 102CFM
HX8-401 8 3.0
(76)
6.0
(152)
1.25
(32)
Clearance None 2.0" O.C.
(2 sets)
0.19 @ 36CFM
(2x18 CFM fans)
HX8-402 8 4.0 (102) 8.0 (204) 1.25 (32) Clearance None 2.0” O.C.
(2 sets)
0.13 @ 45 CFM
 

Bonded Fin Heat Sink Options

Options Description  
L Machined Base Standard
M Metric Holes Standard

Model Part Numbers

HX8 101 L E
Group Series # Options

Series Hole Spacing and Number of TECs

Series # Assembly Hole Spacing A & B Number & Maximum Size of TECs
-100
1.5” (38mm) O.C.
1 x 1.34” (34mm)
-200
2.0” (51mm) O.C.
1 x 1.73” (44mm)
-300
3.0” (76mm) O.C.
1 x 2.44” (62mm)
-400
2.0” (51mm) O.C.
2 x 1.73” (44mm)